Advice on AMlogic "TV stick/dongle" hardware

  • Hi guys!


    I'm going to upgrade my passive cooling solution for my Mecool S905X and I've bought several parts. However, I'm not sure if I should apply a thermal heatsink copper pad shim size 20x20x1.2mm between the CPU and my 40x40x18mm aluminium heatsink. My thermal compound paste is Arctic MX-4 with a thermal conductivity of 8.5 W/(mK). So which of the two ways do you think will be the best?


    1. CPU -> Thermal compound paste -> Aluminium heatsink

    2. CPU -> Thermal compound paste -> 20x20x1.2mm copper pad -> Thermal compound paste -> Aluminium heatsink


    Thanks in advance!

    Edited once, last by CI6N0Z ().

  • No. 1.


    Instead of thermal compound you can use 0.5mm thick Thermal Pad, which sticks heatsink better to processor than compound.

    ODROID N2_S922 4G - 1GB Ethernet, X92_S912_q201 3/32G - 1GB Ethernet Box_Android 7.1.2, Mocool KM8_S905X 2/16 0.1GB Ethernet Box_Android 8.0, X96Mini_S905W 2/16G 0.1GB Ethernet Box_Android 7.1.2

  • No. 1.


    Instead of thermal compound you can use 0.5mm thick Thermal Pad, which sticks heatsink better to processor than compound.

    Thanks!

    I see that the thermal pad has a lower thermal conductivity with 6,0 W/(mK) vs 8.5 W/(mK). Yet I can see why you recommended me thermal pad as the compound is wet and therefor difficult to make sure the heatsink is in place as there is no pressure on it...

    Edited once, last by CI6N0Z ().

  • Useful video on how to apply the paste:-