Hi guys!
I'm going to upgrade my passive cooling solution for my Mecool S905X and I've bought several parts. However, I'm not sure if I should apply a thermal heatsink copper pad shim size 20x20x1.2mm between the CPU and my 40x40x18mm aluminium heatsink. My thermal compound paste is Arctic MX-4 with a thermal conductivity of 8.5 W/(mK). So which of the two ways do you think will be the best?
1. CPU -> Thermal compound paste -> Aluminium heatsink
2. CPU -> Thermal compound paste -> 20x20x1.2mm copper pad -> Thermal compound paste -> Aluminium heatsink
Thanks in advance!